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74LV365 Hex buffer/line driver (3-State)
Product specification Supersedes data of 1997 Mar 04 IC24 Data Handbook 1998 May 29
Philips Semiconductors
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
FEATURES
* Optimized for Low Voltage applications: 1.0 to 3.6V * Accepts TTL input levels between VCC = 2.7V and VCC = 3.6V * Typical VOLP (output ground bounce) t 0.8V @ VCC = 3.3V, * Typical VOHV (output VOH undershoot) u 2V @ VCC = 3.3V, * Non-inverting outputs * Output capability: bus driver * ICC category: MSI
QUICK REFERENCE DATA
GND = 0V; Tamb = 25C; tr = tf v2.5 ns SYMBOL tPHL/tPLH CI CPD PARAMETER Propagation delay nA to nY Input capacitance Power dissipation capacitance per buffer Tamb = 25C Tamb = 25C
DESCRIPTION
The 74LV365 is a low-voltage CMOS device and is pin and function compatible 74HC/HCT365. The 74LV365 is a hex non-inverting buffer/line driver with 3-State outputs. The 3-State outputs (nY) are controlled by the output enable inputs (OE1, OE2). A HIGH on OEn, causes the outputs to assume a high impedance OFF-state.
CONDITIONS CL = 15pF VCC = 3.3V Notes 1 and 2
TYPICAL 9 3.5 40
UNIT ns pF pF
NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in W) PD = CPD x VCC2 x fi )S (CL x VCC2 x fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC
ORDERING INFORMATION
PACKAGES 16-Pin Plastic DIL 16-Pin Plastic SO 16-Pin Plastic SSOP Type II 16-Pin Plastic TSSOP Type I TEMPERATURE RANGE -40C to +125C -40C to +125C -40C to +125C -40C to +125C OUTSIDE NORTH AMERICA 74LV365 N 74LV365 D 74LV365 DB 74LV365 PW NORTH AMERICA 74LV365 N 74LV365 D 74LV365 DB 74LV365PW DH PKG. DWG. # SOT38-4 SOT109-1 SOT338-1 SOT403-1
PIN DESCRIPTION
PIN NUMBER 1, 15 2, 4, 6, 10, 12, 14 3, 5, 7, 9, 11, 13 8 16 SYMBOL OE1, OE2 1A to 6A 1Y to 6Y GND VCC FUNCTION
FUNCTION TABLE
INPUTS OE1 Output enable inputs (active-LOW) Data inputs Data outputs Ground (0V) Positive supply voltage L L X OE2 L L H nA L H X OUTPUT nY L H Z Z
H X X H = HIGH voltage level L = LOW voltage level X = Don't care Z = High impedance OFF-state
1998 May 29
2
853-1932 19466
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
PIN CONFIGURATION
LOGIC SYMBOL (IEEE/IEC)
1 & EN
OE1 1A 1Y 2A 2Y 3A 3Y GND
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
VCC OE2 6A
15
2
3 5 7 9 11 13
4 6Y 6 5A 10 5Y 12 4A 14 4Y
SV00644
SV00646
LOGIC SYMBOL
1A 2 1Y 3
FUNCTIONAL DIAGRAM
2 1A 1Y 3
2A 4
2Y 5
4
2A
2Y
5
3A 6
3Y 7
6
3A
3Y
7
4A 10
4Y 9
10
4A
4Y
9
5A 12
5Y 11
12
5A
5Y
11
6A 14
6Y 13
14
6A
6Y
13
1 15
OE1 OE2
1 15
OE1 OE2
SV00645
SV00647
1998 May 29
3
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
RECOMMENDED OPERATING CONDITIONS
SYMBOL VCC VI VO Tamb DC supply voltage Input voltage Output voltage Operating ambient temperature range in free air See DC and AC characteristics VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V VCC = 2.7V to 3.6V PARAMETER CONDITIONS See Note 1 MIN 1.0 0 0 -40 -40 - - - - - - - TYP 3.3 - - MAX 3.6 VCC VCC +85 +125 500 200 100 UNIT V V V C
tr, tf
Input rise and fall times
ns/V
NOTE: 1. The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
ABSOLUTE MAXIMUM RATINGS1, 2
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0V). SYMBOL VCC IIK IOK IO IGND, ICC Tstg PARAMETER DC supply voltage DC input diode current DC output diode current DC output source or sink current - bus driver outputs DC VCC or GND current for types with -bus driver outputs Storage temperature range Power dissipation per package -plastic DIL -plastic mini-pack (SO) -plastic shrink mini-pack (SSOP and TSSOP) for temperature range: -40 to +125C above +70C derate linearly with 12mW/K above +70C derate linearly with 8 mW/K above +60C derate linearly with 5.5 mW/K VI < -0.5 or VI > VCC + 0.5V VO < -0.5 or VO > VCC + 0.5V -0.5V < VO < VCC + 0.5V CONDITIONS RATING -0.5 to +4.6 20 50 35 UNIT V mA mA mA
70 -65 to +150 750 500 400
mA C
Pt t tot
mW
NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 May 29
4
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
DC CHARACTERISTICS FOR THE LV FAMILY
Over recommended operating conditions. Voltages are referenced to GND (ground = 0V). LIMITS SYMBOL PARAMETER TEST CONDITIONS MIN VCC = 1.2V VIH HIGH l level I l Input t voltage VCC = 2.0V VCC = 2.7 to 3.6V VCC = 1.2V VIL LOW l level I l Input t voltage VCC = 2.0V VCC = 2.7 to 3.6V VCC = 1.2V; VI = VIH or VIL; -IO = 100A VO OH HIGH level output voltage; all outputs VCC = 2.0V; VI = VIH or VIL; -IO = 100A VCC = 2.7V; VI = VIH or VIL; -IO = 100A VCC = 3.0V; VI = VIH or VIL; -IO = 100A VOH HIGH level output voltage; BUS driver outputs VCC = 3.0V; VI = VIH or VIL; -IO = 8mA VCC = 1.2V; VI = VIH or VIL; IO = 100A VO OL LOW level output voltage; all outputs VCC = 2.0V; VI = VIH or VIL; IO = 100A VCC = 2.7V; VI = VIH or VIL; IO = 100A VCC = 3.0V; VI = VIH or VIL; IO = 100A VOL II IOZ ICC ICC LOW level output voltage; BUS driver outputs Input leakage current 3-State output OFF-state current Quiescent supply current; MSI Additional quiescent supply current per input VCC = 3.0V; VI = VIH or VIL; IO = 8mA VCC = 3.6V; VI = VCC or GND VCC = 3.6V; VI = VIH or VIL; VO = VCC or GND VCC = 3.6V; VI = VCC or GND; IO = 0 VCC = 2.7V to 3.6V; VI = VCC - 0.6V 1.8 2.5 2.8 2.40 1.2 2.0 2.7 3.0 2.82 0 0 0 0 0.20 0.2 0.2 0.2 0.40 1.0 5 20.0 500 0.2 0.2 0.2 0.50 1.0 10 160 850 V A A A A V 1.8 2.5 2.8 2.20 V V 0.9 1.4 2.0 0.3 0.6 0.8 -40C to +85C TYP1 MAX -40C to +125C MIN 0.9 1.4 2.0 0.3 0.6 0.8 V V MAX UNIT
NOTE: 1. All typical values are measured at Tamb = 25C.
1998 May 29
5
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
AC CHARACTERISTICS
GND = 0V; tr = tf 2.5ns; CL = 50pF; RL = 1KW LIMITS SYMBOL PARAMETER WAVEFORM CONDITION VCC(V) 1.2 tPHL/tPLH / Propagation delay g y nA to nY 2.0 Figure 1 2.7 3.0 to 3.6 1.2 tPZH/tPZL / 3-State output enable time OEn to nY 2.0 Figure 2 2.7 3.0 to 3.6 1.2 tPHZ/tPLZ / 3-State output disable time OEn to nY 2.0 Figure 2 2.7 3.0 to 3.6 NOTES: 1. All typical values are measured at Tamb = 25C 2. Typical values are measured at VCC = 3.3V MIN - - - - - - - - - - - - -40 to +85 C TYP1 55 19 14 102 85 29 21 162 100 36 27 212 MAX - 36 26 21 - 56 41 33 - 66 48 39 -40 to +125 C MIN - - - - - - - - - - - - MAX - 44 33 26 - 66 49 39 - 78 58 47 ns ns ns UNIT
AC WAVEFORMS
VM = 1.5V at VCC w 2.7V VM = 0.5V * VCC at VCC t 2.7V VOL and VOH are the typical output voltage drop that occur with the output load. VX = VOL + 0.3V at VCC w 2.7V VX = VOL + 0.1VCC at VCC < 2.7V VY = VOH - 0.3V at VCC w 2.7V VY = VOH - 0.1VCC at VCC < 2.7V
VCC nA INPUT GND tPHL VOH nY OUTPUT VOL VM tPLH VCC OUTPUT HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VCC OEn INPUT GND tPLZ VCC OUTPUT LOW-to-OFF OFF-to-LOW VOL tPHZ VM VX tPZH tPZL VM
outputs disabled
outputs enabled
SV00648
Figure 1. Input (nA) to output (nY) propagation delays. Figure 2. 3-State enable and disable times.
SV00649
1998 May 29
6
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
TEST CIRCUIT
VCC S1 2 * VCC Open GND
VI PULSE GENERATOR RT D.U.T.
VO
RL = 1k
50pF
CL
RL = 1k
Test Circuit for switching times DEFINITIONS
RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators.
SWITCH POSITION
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH S1 Open 2 < VCC
GND
VCC < 2.7V 2.7-3.6V
VI VCC 2.7V
SV00895
Figure 3. Load circuitry for switching times
1998 May 29
7
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
1998 May 29
8
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
1998 May 29
9
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
1998 May 29
10
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
1998 May 29
11
Philips Semiconductors
Product specification
Hex buffer/line driver (3-State)
74LV365
DEFINITIONS
Data Sheet Identification
Objective Specification
Product Status
Formative or in Design
Definition
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Preliminary Specification
Preproduction Product
Product Specification
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Document order number: Date of release: 05-96 9397-750-04444
Philips Semiconductors
1998 May 29 12

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